Title:
PHOTOSENSITIVE ELEMENT, PRODUCTION OF RESIST PATTERN USING SAME, PRODUCTION OF PRINTED CIRCUIT BOARD AND PRODUCTION OF LEAD FRAME
Document Type and Number:
Japanese Patent JP3406543
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a photosensitive element which can be laminated in a good yield and is very excellent in peeling characteristics, laminating property, shelf stability and working property, to produce a resist pattern and to produce a printed circuit board or a lead frame with the resist pattern.
SOLUTION: The photosensitive element consists of a supporting film 1, a photosensitive resin composition layer 2 and a protective film 3. The photosensitive resin composition layer 2 contains (A) a binder polymer, (B) a photopolymerizable compound in which the concentration of polymerizable ethylenically unsaturated groups is 0.12-0.26 mol per 100 g, in total, of the components (A) and (B), and (C) a photopolymerization initiator. The number of fish eyes 4 of ≥80 μm diameter contained in the protective film 3 is ≤5 per 1 m2. The element is laminated on a substrate for forming a circuit in such a way that the photosensitive resin composition layer 2 adheres to the substrate and exposure is carried out. The exposed part is photoset and the unexposed part is removed by development.
Inventors:
Katsutoshi Itagaki
Kimura Kimiko
Shinji Takano
Yudai Fukaya
Kimura Kimiko
Shinji Takano
Yudai Fukaya
Application Number:
JP28764699A
Publication Date:
May 12, 2003
Filing Date:
October 08, 1999
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
H05K3/00; B32B27/32; G03F7/004; G03F7/027; G03F7/028; G03F7/032; G03F7/11; (IPC1-7): G03F7/11; B32B27/32; G03F7/004; G03F7/027; H05K3/00
Domestic Patent References:
| JP3136053A | ||||
| JP675371A | ||||
| JP527423A | ||||
| JP683066A | ||||
| JP9118864A |
Attorney, Agent or Firm:
Hidekazu Miyoshi