Title:
PHOTOSENSITIVE INSULATING RESIN COMPOSITION, CURED PRODUCT THEREOF, AND METHOD FOR PRODUCING INSULATING FILM
Document Type and Number:
Japanese Patent JP2014044438
Kind Code:
A
Abstract:
To provide a photosensitive insulating resin composition which suppresses warpage and elongation of a substrate in forming an insulating film and has excellent resolution, sensitivity, electrical insulation properties, etc. and to provide a cured product such as an insulating film formed by curing the composition, and a method for producing an insulating film.
The photosensitive insulating resin composition of the present invention contains: (A) an alkali-soluble resin containing (a1) a structural unit derived from a crosslinkable monomer and (a2) a structural unit having a phenolic hydroxyl group; (B) a crosslinking agent; (C) a photosensitive compound; and (D) a solvent.
Inventors:
SASAKI HIROBUMI
ITO JUNJI
ITO JUNJI
Application Number:
JP2013235185A
Publication Date:
March 13, 2014
Filing Date:
November 13, 2013
Export Citation:
Assignee:
JSR CORP
International Classes:
G03F7/038; C08L101/12; G03F7/004; G03F7/023; G03F7/075; H01L21/027
Domestic Patent References:
| JP2009251392A | 2009-10-29 | |||
| JP2001154357A | 2001-06-08 | |||
| JP2009098606A | 2009-05-07 | |||
| JP2011022509A | 2011-02-03 |
Foreign References:
| WO2007102470A1 | 2007-09-13 |
Attorney, Agent or Firm:
Kiyoshi Kojima
Yoshinobu Hagino
Yasuyuki Hiraiwa
Yoshinobu Hagino
Yasuyuki Hiraiwa