Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING STRUCTURE
Document Type and Number:
Japanese Patent JP2016133661
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having excellent opening property even when a fine opening is to be formed.SOLUTION: The photosensitive resin composition is to be used for a method for manufacturing such a structure that an insulation layer formed on a surface of a substrate having a conductor circuit has an opening and that a wiring part connected to the conductor circuit is formed in the opening. The photosensitive resin composition comprises a binder polymer, a specific photopolymerizable compound, and a photopolymerization initiator.SELECTED DRAWING: None
Inventors:
MURAMATSU YUKIKO
SAWABE MASARU
OTA EMIKO
OKADE SHOTA
LEE SANG CHUL
SAWABE MASARU
OTA EMIKO
OKADE SHOTA
LEE SANG CHUL
Application Number:
JP2015008817A
Publication Date:
July 25, 2016
Filing Date:
January 20, 2015
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
G03F7/027; G03F7/004; G03F7/029; G03F7/033; G03F7/40; H05K3/00; H05K3/46
Domestic Patent References:
| JP2013109323A | 2013-06-06 | |||
| JP2007079128A | 2007-03-29 | |||
| JPH11274727A | 1999-10-08 | |||
| JP2000171970A | 2000-06-23 | |||
| JP2001154346A | 2001-06-08 | |||
| JP2010091789A | 2010-04-22 | |||
| JP2007017722A | 2007-01-25 |
Foreign References:
| WO2013054790A1 | 2013-04-18 | |||
| US20040135292A1 | 2004-07-15 | |||
| WO2014148273A1 | 2014-09-25 | |||
| WO2016117509A1 | 2016-07-28 | |||
| WO2007048586A2 | 2007-05-03 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Tomoya Furoshita
Yoshinori Shimizu
Tomoya Furoshita