To provide a soldering resist or an interlayer insulation material capable of forming an image by short-time exposure with UV by the concomitant use of photo radical polymerization and cationic polymerization and subsequent development with a dilute aqueous alkali solution, capable of completing cationic polymerization and crosslinking with an alkali-soluble resin by short- time heating by the action of a cationic polymerization initiator in the presence of a compound having an oxetane structure after pattern formation and excellent in various characteristics such as adhesion, soldering resistance, pressure cooker resistance and low water absorbing property.
This invention relates a photosensitive resin composition containing an alkali-soluble resin (A), a compound (B) having an oxetane structure, a compound (C) having a radical polymerizable unsaturated group, a photo radical initiator (D) and a cationic polymerization initiator (E), a cured film of the composition and a method for curing the composition.
| JPS51104903 | KANKOSEIZAIRYO OYOBI INSATSUYOGENPAN |
| JPH1026834 | IMAGE FORMING METHOD |
SATO TAKASHI
ASAI YOSHIFUMI
TAKOSHI HIROTAKA
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