Title:
感光性樹脂組成物、硬化レリーフパターンの製造方法
Document Type and Number:
Japanese Patent JP7241502
Kind Code:
B2
Abstract:
To provide a photosensitive resin composition that gives a cured relief pattern that shows excellent sensitivity and suppresses decrease in adhesion to a mold resin, and a cured relief pattern forming method using the photosensitive resin composition.SOLUTION: A negative photosensitive resin composition contains (A) a polyimide precursor having a (meth) acryloyl group; (B) a sulfonyl group-containing compound; and (C) a photopolymerization initiator.SELECTED DRAWING: None
Inventors:
Wataru Murakami
Satoshi Ogura
Ken Shimizu
Satoshi Ogura
Ken Shimizu
Application Number:
JP2018196637A
Publication Date:
March 17, 2023
Filing Date:
October 18, 2018
Export Citation:
Assignee:
ASAHI KASEI KABUSHIKI KAISHA
International Classes:
G03F7/027; C08G73/10; G03F7/004; G03F7/20; H05K1/03
Domestic Patent References:
| JP2002131906A | ||||
| JP2017193500A | ||||
| JP2004043779A | ||||
| JP2018160665A | ||||
| JP2017194677A | ||||
| JP2012194520A |
Foreign References:
| WO2018043467A1 | ||||
| US6524770 |
Attorney, Agent or Firm:
Aoki Atsushi
Shinji Mihashi
Kazuhiro Nakamura
Saito Tsuko
Shunsuke Sanma
Shinji Mihashi
Kazuhiro Nakamura
Saito Tsuko
Shunsuke Sanma