PHOTOSENSITIVE RESIN COMPOSITION, PATTERN CURED FILM AND METHOD FOR PRODUCING THE SAME, SEMICONDUCTOR ELEMENT, AND ELECTRONIC DEVICE

Title:

PHOTOSENSITIVE RESIN COMPOSITION, PATTERN CURED FILM AND METHOD FOR PRODUCING THE SAME, SEMICONDUCTOR ELEMENT, AND ELECTRONIC DEVICE

Document Type and Number:

Japanese Patent JP2020064170

Kind Code:

A

Abstract:

To provide a photosensitive resin composition that can form a cured film having excellent chemical solution resistance at low temperature.SOLUTION: A photosensitive resin composition contains A) an alkali-soluble resin, (B) an acrylic elastomer having a structural unit containing a hydroxy group and a cycloalkyl ring, (C) a compound that produces acid by light.SELECTED DRAWING: None

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Inventors:

KOMINE TAKUYA

Application Number:

JP2018195643A

Publication Date:

April 23, 2020

Filing Date:

October 17, 2018

Export Citation:

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Assignee:

HITACHI CHEMICAL CO LTD

International Classes:

G03F7/023; G03F7/004; G03F7/20

Domestic Patent References:

JP2015079191A	2015-04-23
JP2012162642A	2012-08-30

Attorney, Agent or Firm:

Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano

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