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Patent Searching and Data


Title:
フォトレジスト用感光性樹脂組成物
Document Type and Number:
Japanese Patent JP3987491
Kind Code:
B2
Abstract:
The present invention relates to a photosensitive resin composition for use as a photoresist, and more particularly, to a photosensitive resin composition for a photoresist comprising an acrylate copolymer obtained by selectively using specific compounds or controlling the ratio of unreacted monomers, and a 1,2-quinonediazide compound, which is excellent in several performance factors such as dielectric characteristics, flatness, transparency, developing performance, residual film rate, chemical resistance, and heat resistance, as well as sensitivity and resolution, and in particular it facilitates easy pattern formation into interlayer dielectrics, and it can be used as a photoresist in an LCD manufacturing process due to its excellent transmissivity even when prepared as a thick film.

Inventors:
Kim, Bing-Wook
Butterfly, Joan-Young
Kwon, Kyung-Il
Park, So-Jun
Yeo, Jae-won
Application Number:
JP2003521446A
Publication Date:
October 10, 2007
Filing Date:
August 20, 2002
Export Citation:
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Assignee:
Doujin Semichem Company Limited
International Classes:
G03F7/023; G03F7/033; C08F216/36; C08L33/02; G03F7/004; G03F7/022; G03F7/027; G03F7/038; H01L21/027
Domestic Patent References:
JP6348017A
JP4198937A
JP3208055A
JP5165214A
JP8262709A
JP2000347397A
JP2000327877A
JP2000327875A
JP2000250208A
Attorney, Agent or Firm:
Koichi Kajisaki
Yuzo Ozaki
Toshihiko Taniguchi