Title:
感光性樹脂組成物、感光性ドライフィルム及びパターン形成方法
Document Type and Number:
Japanese Patent JP7056541
Kind Code:
B2
Abstract:
A photosensitive resin composition comprising a polymer containing a silphenylene skeleton and a fluorene skeleton and having a crosslinkable site in the molecule, a phenol compound having a Mw of 300-10,000, a photoacid generator, and a benzotriazole or imidazole compound has improved film properties. Even from a thick film, a fine size pattern can be formed.
Inventors:
Yoshinori Hirano
Michihiro Sugo
Satoshi Asai
Takahiro Goi
Michihiro Sugo
Satoshi Asai
Takahiro Goi
Application Number:
JP2018237135A
Publication Date:
April 19, 2022
Filing Date:
December 19, 2018
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
G03F7/075; C08G59/30; C08G77/60; G03F7/004; G03F7/038; G03F7/20; H05K3/18
Domestic Patent References:
| JP2016071355A |
Attorney, Agent or Firm:
Hideaki International Patent Office