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Patent Searching and Data


Title:
PHOTOSENSITIVE RESIN COMPOSITION AND POLYBENZOXAZOLE RESIN
Document Type and Number:
Japanese Patent JP2003183390
Kind Code:
A
Abstract:

To provide a photosensitive resin composition which can simply and efficiently be produced, can reduce the environmental pollution in its production, and enables high resolving patterning, and a polybenzoxazole resin obtained from the photosensitive resin composition.

The photosensitive resin composition is obtained by compounding a polybenzoxazole precursor composed of a polyhydroxyazomethine with a sensitizer composed of a 1,4dihydropyridine derivative. This photosensitive resin composition is simply and efficiently produced and enables cost-cutting, reduction in environmental pollution, and improvement on corrosion resistance. The polybenzoxazole resin can be obtained in a positive pattern by exposing the photosensitive resin composition and developing the exposed photosensitive resin composition. This resin is patterned at a high resolving degree, has excellent electrical properties and mechanical properties, and can improve reliability.


Inventors:
KANESHIRO NAOTAKA
MOCHIZUKI SHU
KONDO TAKASHI
Application Number:
JP2001385755A
Publication Date:
July 03, 2003
Filing Date:
December 19, 2001
Export Citation:
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Assignee:
NITTO DENKO CORP
International Classes:
G03F7/004; C08G73/08; G03F7/039; H01L21/027; (IPC1-7): C08G73/08; G03F7/004; G03F7/039; H01L21/027
Attorney, Agent or Firm:
Hiroyuki Okamoto