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Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS6156341
Kind Code:
A
Abstract:

PURPOSE: To improve removability by using an org. halogen compd., specific compd., ethylenic unsatd. compd., filming property imparting polymer, etc.

CONSTITUTION: The org. halogen compd. and the compd. expressed by the formula (R is hydrogen or alkyl group of ≤4 C) are combined as the components necessary for improving resist removability and are incorporated into a photosensitive resin compsn. contg. the ethylenic unsatd. compd., filming property imparting polymer and sensitizer and/or sensitizer system which can form free radicals by active rays. The good removability is obtd. by using such components in the photosensitive resin compsn. There is carbon tetrachloride or the like as the example of the org. halogen compd. and 1W3-benzotriazole is preferble as the example of the compd. expressed by the formula. An acrylate monomer or the like is preferable as the ethylenic unsatd. compd. The ethylenic unsatd. compd. is used preferably in a 10W45wt% range for the filming property imparting polymer.


Inventors:
MASAOKA KAZUTAKA
MINAMI YOSHITAKA
KAKUMARU HAJIME
FUJITA EIJI
UCHIGASAKI ISAO
Application Number:
JP16720584A
Publication Date:
March 22, 1986
Filing Date:
August 09, 1984
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
G03C1/00; G03F7/004; G03F7/085; H05K3/00; (IPC1-7): G03C1/00; G03C1/68; G03F7/10
Attorney, Agent or Firm:
Kunihiko Wakabayashi



 
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