Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS6274920
Kind Code:
A
Abstract:

PURPOSE: To obtain the titled composition excellent in photosensitivity, thermal properties, electrical insulatability and processability, by mixing a specified compound with an epoxy compound and a photoinitiator or a photosensitizer.

CONSTITUTION: A compound (A) of formula III is obtained by reacting a novolak epoxy resin of formula I (wherein R1 is H or a 1W5C alkyl and n is an integer) with an unsaturated carboxylic acid of formula II (wherein R2 is H or methyl and R3 is H, methyl, cyano, a halogen or carboxymethyl) at about 100°C for 3W8hr in the presence of a catalyst (e.g., trimethylbenzylammonium chloride) and a thermal polymerization inhibitor (e.g., hydroquinone monomethyl ether). Component A is mixed with 0.1W3wt% compound (B) having at least one epoxy group (e.g., novolak epoxy resin) and 0.001W0.3wt% photoinitiator or photosensitizer (C) which can generate free radicals upon irradiation with actinic light (e.g., acetophenone) and the mixture is dissolved in a solvent (e.g., methyl ethyl ketone).


Inventors:
IWAYA YOSHIAKI
HIYA MASANOBU
MARUYAMA MEGUMI
Application Number:
JP21563285A
Publication Date:
April 06, 1987
Filing Date:
September 27, 1985
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
UNITIKA LTD
International Classes:
C08F20/20; C08F20/10; C08G59/00; C08G59/18; C08G59/40; (IPC1-7): C08F20/20; C08G59/18