PURPOSE: To obtain a structure of a piezoelectric component with small size and high stability and its manufacture by applying direct bonding to a stress buffer plate having a Young's modulus smaller than that of a vibration piezoelectric plate or a base which has a smaller thermal expansion rate, the vibration piezoelectric plate and a base so as to fix them.
CONSTITUTION: A stress buffer plate 3 has a Young's modulus smaller than that of a vibration piezoelectric plate 1 or a base 2 which has a smaller thermal expansion rate. Furthermore, part of the vibration piezoelectric plate 1 in the vicinity of its surrounding is fixed to the stress buffer plate 3 by direct bonding and part of the stress buffer plate 3 is fixed to the base 2 by direct bonding. Since the vibration piezoelectric plate 1 uses no adhesives but is fixed by direct bonding in this way, a stress due to contraction/expansion of the adhesives is not exerted to the piezoelectric plate 1 and no gas is generated from the adhesives. Furthermore, it is not required to take a difference between the thermal expansion rate of the adhesives and the piezoelectric plate 1 and heat resistance of the adhesives into account, then heat processing at a high temperature is attained.
IKEDA MASARU
TOMITA YOSHIHIRO
EDA KAZUO
