Title:
PIEZOELECTRIC ELEMENT MOUNTING APPARATUS
Document Type and Number:
Japanese Patent JP2016208286
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a piezoelectric element mounting apparatus capable of stably applying a conductive adhesive on electrode pads and improving productivity.SOLUTION: The piezoelectric element mounting apparatus includes a holding base TA for holding a package arranging jig PJ in which packages are arranged, coating means TS having a first nozzle NZ1 and a second nozzle NZ2 for applying a conductive adhesive to electrode pads provided on the package, recognition means NS having a camera unit CA for recognizing electrode pads, mounting means JS having a third nozzle NZ3 and a fourth nozzle NZ4 for mounting the piezoelectric element 120 on the electrode pad, cleaning means CS for cleaning the space between the first nozzle NZ1 and the second nozzle NZ2, and control means SS for controlling the coating means TS and mounting means JS according to information obtained from the camera unit CA and for moving the cleaning means CS.SELECTED DRAWING: Figure 3
Inventors:
YOKOYAMA YUTAKA
Application Number:
JP2015088113A
Publication Date:
December 08, 2016
Filing Date:
April 23, 2015
Export Citation:
Assignee:
KYOCERA CRYSTAL DEVICE CORP
International Classes:
H03H3/02; H01L41/053; H01L41/187; H01L41/23; H01L41/313; H03H9/10