To reduce the thickness of a piezoelectric element and a piezoelectric vibration board using it, and to miniaturize the piezoelectric element and improve the sound pressure of the piezoelectric vibration board.

Three piezoelectric layers 12A, 12B, and 12C are formed at a laminate 12 in a stacking direction. A first electrode 14A and a second electrode 17A are provided across a gap 11 on the first main surface of the piezoelectric layer 12A. A third electrode 17B opposing the first electrode and a fourth electrode 14B opposing the second electrode are provided with a gap on the second main surface. The first electrode and the fourth electrode are connected to each other through a connection conductor 15A and through holes conductors 16A and 16B. The second electrode and the third electrode are connected to each other by a connection conductor 18A and through hole conductors 19A and 19B. By this, the area dimension of a piezoelectric element 10 required for obtaining the same sound pressure is reduced to obtain a smaller size.

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