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Patent Searching and Data


Title:
PLANAR MEMBER POLISHING DEVICE
Document Type and Number:
Japanese Patent JP3837706
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To reduce the weight of moving parts having pressure contact members and the attached structures by performing advancing operations by only the moving parts to bring the surface of a polishing tape into pressure contact with a polished surface of a planar member and performing retreating operations by only the moving parts after polishing, and also to improve workability by enabling high speed moving of the moving parts.
SOLUTION: This device comprises: a holding base 3 to hold the planar member W; a feed mechanism 4 for a feed motion of the holding base 3; the polishing tape T; a tape transfer mechanism 5 to transfer the surface of the polishing tape T in a facing state with the polished surface of the planar member; and a pressure contact member 15 to bring the surface of the polishing tape T into pressure contact with the polished surface of the planar member by pushing a rear side of the polishing tape T. The device also comprises: a moving guide mechanism 16 to guide the pressure contact member 15 in advancing and retreating directions in the pressing direction; and a separating mechanism 17 for the retreating operation of the pressure contact member 15 to bring the surface of the polishing tape T into pressure contact with the polished surface of the planar member by pressing the rear side of the tape T from the midst of the advancing operation to the operation to release the pressure contact.


Inventors:
Hosokai Nobuwa
Application Number:
JP2002159897A
Publication Date:
October 25, 2006
Filing Date:
May 31, 2002
Export Citation:
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Assignee:
Sanshin Co., Ltd.
Hakuto Co., Ltd.
International Classes:
B24B21/00; B24B21/08; B24B21/18; (IPC1-7): B24B21/00; B24B21/18
Domestic Patent References:
JP6198554A
JP49068391A
JP9126245A
JP2001071251A
Foreign References:
US3374583
Attorney, Agent or Firm:
Yuji Kuroda