Title:
フェムト秒パルスレーザーを用いたプランニング－ポリッシング装置及び方法
Document Type and Number:
Japanese Patent JP7149013
Kind Code:
B2
Abstract:
Proposed is a planing-polishing apparatus 1 using a femtosecond pulsed laser and performing polishing of a planar workpiece to reduce surface roughness of the workpiece after performing planing of the workpiece using a femtosecond pulsed laser beam.
Inventors:
Kim, Seong Hwan
Kang, Hyun Sik
Yoo, Dong Bin
Kang, Hyun Sik
Yoo, Dong Bin
Application Number:
JP2021125056A
Publication Date:
October 06, 2022
Filing Date:
July 30, 2021
Export Citation:
Assignee:
21TH CENTURY CO., LTD
International Classes:
B23K26/00; B23K26/352
Domestic Patent References:
| JP2020514067A | ||||
| JP2008119718A | ||||
| JP2019506298A | ||||
| JP202059030A |
Foreign References:
| WO2021039881A1 |
Attorney, Agent or Firm:
Shin Shin