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Title:
PLANT FIBER-BASED HEAT-INSULATING BOARD
Document Type and Number:
Japanese Patent JP2011218764
Kind Code:
A
Abstract:

To provide a plant fiber-based heat-insulating board having strength while securing a heat insulating property.

The plant fiber-based heat-insulating board 10 includes a plant fiber-based core material 12 and a plant fiber body 14. The plant fiber-based core material 12 has a thin-walled wall 12A and a plurality of holes 12B which are partitioned by the thin-walled wall 12A and pass through the plant-fiber-based heat-insulating board 10 in the thickness direction, and formed so as to be positioned over the entire plant fiber-based heat-insulating board 10. The plant fiber body 14 is composed of plant fibers which are fixedly attached to the periphery of a core material 12 and the inner part of the plurality of holes 12B and compressed. The conventionally publicly known various plant fibers such as pulp fibers (containing regenerated pulp fibers), wood fibers, hemp fibers, and bamboo fibers can be used as the plant fibers.


Inventors:
TAKAHASHI ICHIRO
TAKAYAMA KATSUYUKI
NOBORI MICHIO
NAKAZONO AKIRA
KOBAYASHI MITSUHIRO
SUGANO GENZO
Application Number:
JP2010096607A
Publication Date:
November 04, 2011
Filing Date:
April 20, 2010
Export Citation:
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Assignee:
FUJITA CORP
OJI PACKAGING SYSTEMS CO LTD
SHIN NIPPON FEATHER CORE CO LTD
International Classes:
B27N3/04; D04H1/24; E04B1/80; E04C2/16; E04C2/36
Attorney, Agent or Firm:
Shigeru Noda