Title:
プラズマ処理装置及び制御方法
Document Type and Number:
Japanese Patent JP6890459
Kind Code:
B2
Abstract:
Provided is a plasma processing apparatus including a microwave radiating mechanism configured to radiate microwaves output from a microwave output unit into a processing container. The microwave radiating mechanism includes: an antenna configured to radiate the microwaves; a dielectric member configured to transmit the microwaves radiated from the antenna, and form an electric field for generating surface wave plasma by the microwaves; a sensor provided in the microwave radiating mechanism or adjacent to the microwave radiating mechanism, and configured to monitor electron temperature of the generated plasma; and a controller configured to determine a plasma ignition state based on the electron temperature of the plasma monitored by the sensor.
More Like This:
Inventors:
Taro Ikeda
Yuki Nagata
Yuki Nagata
Application Number:
JP2017080621A
Publication Date:
June 18, 2021
Filing Date:
April 14, 2017
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H05H1/00; H01L21/3065; H05H1/46
Domestic Patent References:
| JP2013077441A | ||||
| JP5304118A | ||||
| JP4206198A | ||||
| JP2013171847A | ||||
| JP2008091218A |
Foreign References:
| US5374327 |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito