Title:
PLASMA PROCESSING SYSTEM
Document Type and Number:
Japanese Patent JP2939355
Kind Code:
B2
Abstract:
PURPOSE: To prevent dew condensation accompanying cooling and high frequency from leaking.
CONSTITUTION: A cover 10, made of low thermal conductivity resin, such as vinyl chloride resin, is of cylindrical shape with a bottom. The cover 10 is provided so that it will cover the bottom side of a bottom electrode 3 and a refrigerant circulation pipe 8 with a gap between the cover and them. The cover 10 is fixed to a flange of the bottom part of a connecting material 5. In addition, the surface of the cover 10 has a conductor layer 10a formed by, for example, electroless nickel plating.
Inventors:
FUKAZAWA KAZUO
SUETSUGU MASACHIKA
SUETSUGU MASACHIKA
Application Number:
JP9040191A
Publication Date:
August 25, 1999
Filing Date:
April 22, 1991
Export Citation:
Assignee:
TOKYO EREKUTORON KK
International Classes:
C23C14/56; C23C16/44; H01J37/32; H01L21/205; H01L21/302; H01L21/3065; H01L21/31; (IPC1-7): H01L21/205; H01L21/3065; H01L21/31
Attorney, Agent or Firm:
Suyama Saichi