To provide a plasma treating apparatus in which abnormal discharges are made difficult to be generated by the return currents of high frequency currents.
This plasma treating apparatus is constituted of a chamber 1 whose inside part can be held in a vacuum state, and a lower electrode 2 supporting a substrate W to which high frequencies are impressed, an upper electrode 16 provided so as to be faced to the lower electrode, a high-frequency power source 11 for forming plasma of a treatment gas between the upper electrode and the lower electrode, a power feeding member 8 for feeding power from the high-frequency power source 11 to the lower electrode 2, and an impedance adjusting means 30 for adjusting the impedance of a return current circuit returning from the plasma, at least through the inner wall of the chamber 1 to the high-frequency power source.
KAWABATA JUNJI
TOZAWA SHIGEKI
ISHIKAWA HIROSHI
NISHIBE HARUHITO
SEMICONDUCTOR LEADING EDGE TEC
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