To carry out laminating without warping a plate by suppressing damage of the plate due to contact with a guide.
A plate lamination device 50 comprises an attraction section 59 for attracting a plate, a plate lamination section 75 for laminating a plurality of plates, and an elevation mechanism 45 for vertically moving the plate held by the attraction section 59 in a direction of being in close proximity to the lower face of the plate lamination section 75. The attraction section 59 releases the attraction force to the plate, before the plate held by the attraction section 59 is brought into contact with the lower face of the attraction section of the plate lamination section 75 or the lower face of the plate which is laminated thereto and is at the outermost layer.
ANDO YUTAKA
TERAKURA TATSUO
MATSUYAMA TOSHIYA
Makoto Suhara
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