Title:
PLATING DEVICE AND PLATING LIQUID REMOVING METHOD
Document Type and Number:
Japanese Patent JP3284496
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To easily and rapidly remove a plating liquid remaining in an abutment part of a substrate holding section with a substrate to necessitate a simple structure and smaller floor area.
SOLUTION: This device has a head section 47 provided with a freely rotatable housing 70 having the substrate holding section 72 for holding the substrate W, a plating treating vessel 46 which is arranged below the head section 47 and holds the plating liquid 45 and a plating liquid removing means 300 which removes the plating liquid sticking to the abutment part 360 or the vicinity of the housing 70 with the substrate at the inner peripheral end of the substrate holding section 72.
Inventors:
Satoshi Chiyo
Kenya Tomioka
Katsumi Tsuda
Kenya Tomioka
Katsumi Tsuda
Application Number:
JP2000241503A
Publication Date:
May 20, 2002
Filing Date:
August 09, 2000
Export Citation:
Assignee:
Ebara Corporation
International Classes:
C23C18/38; C25D7/12; C25D17/00; C25D21/00; H01L21/288; H01L21/768; (IPC1-7): C25D7/12; C25D21/00; H01L21/288
Domestic Patent References:
| JP200189898A | ||||
| JP2001303295A | ||||
| JP2001223184A | ||||
| JP2001158968A |
Attorney, Agent or Firm:
Isamu Watanabe (1 person outside)