PURPOSE: To obtain a plating device and a plating treatment system where material to be plated is set by a simple method on a plating liquid jet mechanism from a transfer line and when plural transfer lines are installed, the material to be plated is independently transferred by each transfer line and when a jig is replaced, only in a line for which the jig is to be replaced, transfer is stopped and in other lines, transfer and treatment are performed.

CONSTITUTION: A plating liquid jet mechanism 8 arranged in mid-way of and below a transfer line L2 where rotary rollers 9 for transferring material to be plated in the form of a frame 2 are continuously formed on both sides and a press mechanism where the material to be plated 2 mounted on the plating liquid jet mechanism 8 is pressurized from above are provided. In the plating device, a stop means 7 for stopping the material to be plated 2 at the corresponding position just above the plating liquid jet mechanism 8, a set means 5, 6 for moving the rotary rollers 4 in the separating direction and downwards and a lift means 13 for lifting the material to be plated 2 are provided.