Title:
PLATING APPARATUS AND PLATING METHOD
Document Type and Number:
Japanese Patent JP2023069447
Kind Code:
A
Abstract:
To improve detection accuracy of anomalies of various devices and/or advance the timing of the anomaly detection.SOLUTION: A plating apparatus for plating a substrate comprises: an anode arranged so as to face the substrate; an electric field adjusting member having an aperture arranged between the substrate and the anode, and an aperture adjusting member for changing the size of the aperture; a motor for driving the aperture adjusting member; and a control device for acquiring a current value or a load factor of the motor, calculating the amount of change of the load factor of the motor per unit time based on the current value or load factor of the motor, and detecting the anomaly of the electric field adjusting member when the amount of change of the load factor of the motor per unit time is detected to be over a prescribed threshold level.SELECTED DRAWING: Figure 7
Inventors:
DEGUCHI KAZUMA
WAKABAYASHI HIDEKI
KOIZUMI TATSUYA
WAKABAYASHI HIDEKI
KOIZUMI TATSUYA
Application Number:
JP2021181295A
Publication Date:
May 18, 2023
Filing Date:
November 05, 2021
Export Citation:
Assignee:
EBARA CORP
International Classes:
C25D17/10; C25D21/12
Attorney, Agent or Firm:
Toru Miyamae
Yukio Kanegae
Makoto Watanabe
Tatsumi Ono
Yukio Kanegae
Makoto Watanabe
Tatsumi Ono
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