Title:
PLATING METHOD AND APPARATUS
Document Type and Number:
Japanese Patent JPS6187895
Kind Code:
A
Abstract:
PURPOSE:To electroplate the insides of blind holes each having a high aspect ratio by facing auxiliary electrodes in the blind holes with each other at the necessary intervals between the electrode and the bottom of the hole and between the electrode and both sides of the hole and by spouting a plating soln. CONSTITUTION:When an article 1 having blind holes 2 each having a high aspect ratio is plated, the article 1 is suspended from a hook through a handle 10 and immersed in a plating soln. 8 in a plating tank 7. The plating soln, 8 is sucked with pumps 9 and spouted out to the bottoms and both sides of the holes 2 from nozzles 4 which are used as auxiliary anodes in common through passages 3 used as anodes.
Inventors:
TAKAKURA YOSHINORI
Application Number:
JP20751084A
Publication Date:
May 06, 1986
Filing Date:
October 03, 1984
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
C25D7/04; (IPC1-7): C25D7/04
Attorney, Agent or Firm:
Masuo Oiwa