Title:
めっき方法及び装置
Document Type and Number:
Japanese Patent JP4043192
Kind Code:
B2
Abstract:
The present invention provides a plating method and apparatus, which is capable of introducing plating solution into the fine channels and holes formed in a substrate without needing to add an surface active agent to the plating solution, and capable of forming a high-quality plating film having no defects or omissions. The plating method for performing electrolytic or electroless plating of an object using a plating solution comprises: conducting a plating operation after or while deaerating dissolved gas from the plating solution; and/or conducting a preprocessing operation using a preprocessing solution after or while deaerating dissolved gas from the preprocessing solution and subsequently conducting the plating operation.
Inventors:
Junichiro Yoshioka
Saito Nobutori
Go Tokuoka
Saito Nobutori
Go Tokuoka
Application Number:
JP2000581278A
Publication Date:
February 06, 2008
Filing Date:
November 08, 1999
Export Citation:
Assignee:
Ebara Corporation
International Classes:
C25D5/34; C23C18/16; C23C18/18; C25D5/00; C25D7/12; C25D17/00; C25D21/00; C25D21/04; H05K3/18; H05K3/42
Domestic Patent References:
| JP4341341A | ||||
| JP6280098A | ||||
| JP9219404A | ||||
| JP10214838A | ||||
| JP9264000A | ||||
| JP11333206A | ||||
| JP2000005504A |
Attorney, Agent or Firm:
Isamu Watanabe
Ryoji Kosugi
Tetsuya Hirosawa
Ryoji Kosugi
Tetsuya Hirosawa