To meet requirement for the flatness and uniformity in a substrate to be polished with sufficient accuracy, and at the same time to reduce edge exclusion to a narrow range.

A polishing pad 60 is composed of a base member 61 mounted onto a polishing pad mounting surface 51a of a polishing tool 50, and a number of polishing members 62, 62, and the like that are bonded to the base member 61 and project to the side of a substrate retention table 10. As the material of the polishing members 62, 62, and so on, a hard material is used. The hard material has hardness for flattening a surface 91 to be polished of the substrate 90 to be polished, and includes an epoxy resin, hard foamed polyurethane, and the like. Also, for the material of the base member 61, a softer material such as rubber than the polishing members 62, 62, and so on is used.