Title:
POLISHING CARRIER FOR GLASS WAFER AND ITS POLISHING METHOD
Document Type and Number:
Japanese Patent JPH0655434
Kind Code:
A
Abstract:
PURPOSE: To provide a polishing carrier for glass wafer and its polishing method for polishing the thin glass wafer with good accuracy and in a short time.
CONSTITUTION: In a polishing carrier for thin glass wafer having a thickness of up to 1mm and used in a double-face polishing machine, the polishing carrier for glass wafer is characterized in that the gear part of a glass fiber resin-made carrier is of metal-reinforced double structure and the metal-made gear part is thicker than the glass fiber resin by 0.1-0.2mm. This polishing method uses a step-shaped polishing carrier for assuring the strength of its connection part and is used for polishing the glass wafer.
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Inventors:
FUJIMURA YORITO
SHIBANO YUKIO
TAKITA MASATOSHI
SHIBANO YUKIO
TAKITA MASATOSHI
Application Number:
JP13770292A
Publication Date:
March 01, 1994
Filing Date:
April 30, 1992
Export Citation:
Assignee:
SHINETSU CHEMICAL CO
International Classes:
B24B37/27; B24B37/28; (IPC1-7): B24B37/04
Attorney, Agent or Firm:
Ryoichi Yamamoto (1 person outside)
Next Patent: 製図台に於ける図板取付装置