Title:
POLISHING COMPLEX
Document Type and Number:
Japanese Patent JP2002018727
Kind Code:
A
Abstract:
To provide a polishing complex excellent in polishing performance, easily disposed of after use without applying load to global environment, and excellent in polishing efficiency with little electrostatic charge.
In this polishing complex containing matrix resin and abrasive, the matrix resin is biodegradable resin and is provided with the following material properties; a fusing point is 60-190°C, the number average molecular weight is 5000 or more, and the half-life of charging voltage in electrostatic chargeability is 180 sec or less.
Inventors:
KUBO KIMITO
ISHIOKA RYOJI
OKINO YOSHIRO
ISHIOKA RYOJI
OKINO YOSHIRO
Application Number:
JP2000208209A
Publication Date:
January 22, 2002
Filing Date:
July 10, 2000
Export Citation:
Assignee:
KENKO SANGYO KK
SHOWA HIGHPOLYMER
SHOWA HIGHPOLYMER
International Classes:
B24B31/14; B24D3/28; B24D3/34; C08J5/14; C08K3/00; C08L101/16; C09K3/14; (IPC1-7): B24D3/34; B24B31/14; B24D3/28; C08J5/14; C08K3/00; C08L101/16; C09K3/14
Attorney, Agent or Firm:
Soga Doteru (6 people outside)