Title:
研磨加工装置、研磨加工システム及び研磨加工方法
Document Type and Number:
Japanese Patent JP7146173
Kind Code:
B2
Abstract:
To provide a polishing device, a polishing system and a polishing method capable of performing polishing a large area of a planar shaped product stably in a short time, as well as, of reducing size of equipment and a manufacturing cost.SOLUTION: A polishing device 1 performs polishing by: causing a polishing material K to flow to form a fluidized bed F in a processing chamber 10 storing the polishing material K; and generating an air flow flowing from the fluidized bed F to a workpiece W through an air nozzle 30 comprising an ejection port 30a formed in a substantially rectangular shape so that the generated air flow causes the fluidized polishing material K to hit for polishing against a processing target region of the workpiece W.SELECTED DRAWING: Figure 1
Inventors:
Suzuki Rinsei
Application Number:
JP2019021259A
Publication Date:
October 04, 2022
Filing Date:
February 08, 2019
Export Citation:
Assignee:
Shinto Industry Co., Ltd.
International Classes:
B24C5/02; B24C9/00
Domestic Patent References:
| JP2002113663A | ||||
| JP2005246587A | ||||
| JP2011025344A |
Foreign References:
| WO2013046854A1 |
Attorney, Agent or Firm:
Takuma Makino
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