To easily clean a polishing liquid recovering member and the periphery thereof.

This polishing device is provided with an upper polishing plate 20 and a lower polishing plate 10 for pinching a work W to be polished from over and under thereof, and a polishing liquid supply unit 60 for supplying the polishing liquid to the work W to be polished. The polishing liquid recovering member 70 for recovering the polishing liquid leaked downward from an outer end of the lower surface plate 10 is arranged under the outer end of the lower surface plate 10, and the polishing liquid recovering member 70 is provided freely to elevate between a polishing liquid recovering position close to the outer end of the lower surface plate 10 and a cleaning position separated downward from the outer end of the lower surface plate 10.