Title:
POLISHING DEVICE
Document Type and Number:
Japanese Patent JPH1133902
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To confirm a discrimination of finishing of a polishing process on the basis of a change of torque by providing a pressure measuring means for measuring the torque applied to spindles with the rotation of a surface plate. SOLUTION: A surface plate 21, to which a polyurethane polishing cloth 22 is fitted, is formed of a rigid material such as ceramic, and rotatable spindles 241 , 242 are provided just over an area, which is separated from the center of the surface plate 21 at about R/2, with a space between them. The spindles 241 , 242 are rotated by rotary motors 261 , 262 . Piezoelectric elements 251 , 252 for measuring the torque to be applied from the surface plate 21 through wafers 29,, 29, are arranged in the spindles 241 , 24, The torque to be applied to the spindles 241 , 242 is small at the initial time of the polishing, and the torque is gradually increased with a progress of the polishing. A stage difference of a surface between the wafers 291 , 292 is eliminated by polishing, and when the polishing progresses to the polishing of a flat film, torque change is eliminated. Consequently, this time when the torque change is eliminated is discriminated as the end of the polishing process.
Inventors:
OTANI AKIRA
Application Number:
JP19660497A
Publication Date:
February 09, 1999
Filing Date:
July 23, 1997
Export Citation:
Assignee:
NIPPON KOKAN KK
International Classes:
B24B37/013; H01L21/304; (IPC1-7): B24B37/04; H01L21/304
Attorney, Agent or Firm:
Yoshio wreath
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