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Patent Searching and Data


Title:
POLISHING DEVICE
Document Type and Number:
Japanese Patent JPS62271669
Kind Code:
A
Abstract:

PURPOSE: To make it possible to efficiently perform a machining process such as a chamfering process, a deburring process or the like, on a mass-producing base, by chamfering workpieces with the use of rotation of a planner grindstone, and by discharging the workpieces which become having a size less than a predetermined value, successively, under centrifugal force.

CONSTITUTION: Workpieces 2 from a supply device 6 are fed into a workpiece holding section 5 by a predetermined amount in association with the alternative opening and closing operations of shutters 6a, 6b, and when a planner grindstone 4 on a support plate 9 is rotated by means of a rotary shaft 10, the workpieces 2 roll toward a wall plate 5a one by one while they are subjected to required chamfering polish. Further, workpieces 2a which have be subjected to the required chamfering process and therefore, become having a size less than a predetermined value, are automatically discharged under centrifugal force through a gap 7 previously set between the wall plate 5a and the planner grindstone 4, and are stored in a workpiece storage section 8. Thus, it is possible to efficiently carry out a polishing surface such as a chamfering process or the like on a mass-production base.


Inventors:
MIYATANI TAKASHI
SUZUKI YASUO
OOYAMA IWANE
NAKADA JUNJI
KUMOCHI KIYOTAKA
KINOSHITA HIDETOSHI
Application Number:
JP11252086A
Publication Date:
November 25, 1987
Filing Date:
May 19, 1986
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
B24B31/00; B24B31/108; (IPC1-7): B24B31/00
Attorney, Agent or Firm:
Noriyuki Noriyuki