Title:
POLISHING LIQUID
Document Type and Number:
Japanese Patent JP2022025972
Kind Code:
A
Abstract:
To provide a polishing liquid that can improve polishing rate compared to when an aqueous solution containing only dissolved organic salt indicating alkalinity upon hydrolysis is used as polishing liquid and that contains no metal.SOLUTION: A polishing liquid for use in polishing one surface of a wafer by using a fixed abrasive grain polishing pad with abrasive grains fixed in the pad is provided. The polishing liquid contains no abrasive grains, and contains dissolved organic salt indicating alkalinity upon hydrolysis and containing no metal and an organic alkali containing no metal. Preferably, the organic salt is composed of a strong alkali cation and a weak acid anion, and the organic alkali includes one or more of an ammonia, an amin and an amino acid of basicity.SELECTED DRAWING: Figure 1
Inventors:
SAKAI AYUMI
ARIFUKU NORIHISA
SATO TAKESHI
ARIFUKU NORIHISA
SATO TAKESHI
Application Number:
JP2020129207A
Publication Date:
February 10, 2022
Filing Date:
July 30, 2020
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B37/00; B24B37/24; H01L21/304
Attorney, Agent or Firm:
Matsumoto
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
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