PURPOSE: To efficiently polish an organic matter of poor grinding efficiency by adding solvent to abrasive powder to perform dissolution with solvent and mechanical polishing with abrasive powder at the same time.
CONSTITUTION: In a method of polishing a non-flexible organic polymer or composite material (organic matter and inorganic matter, or metal and resin) for instance in a favorable method of plane polishing of an insulation layer in a manufacturing process of thin film multilayer substrate, rugged by wiring and used for an electronic circuit, abrasive power impregnated with grinding grains 7 and solvent 6 is used for a polishing jig 5 to polish the surface of an organic resin 1 on a substrate 2 while being dissolved. That is, the organic resin at the rugged portion is dissolved and collapsed with solvent, metal is polished with grinding grains and organic matter is dissolved/polished with solvent. Actually, a solvent supply is added to a tape grinding grain polishing device to give composite material treatment for tape polishing.
YAMAZAKI TETSUYA
FUKUSHIMA MAKOTO
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