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Title:
POLISHING METHOD FOR WORK
Document Type and Number:
Japanese Patent JPH04129664
Kind Code:
A
Abstract:

PURPOSE: To shorten both net polishing time and changing time of a polishing liquid by changing a polishing liquid fed to a polishing device over to the polishing liquid of small polishing particle from that of a large one under operation of a polishing device.

CONSTITUTION: A polishing liquid including the polishing particle which polishes the surface roughness of a work (aluminum substrate for magnetic disk) A in the specified surface roughness, and one kind or plural kinds of polishing liquids including the polishing particle of a relatively large grain size which polishes the surface roughness of a work in the surface roughness larger than that obtained by the use of the polishing liquid are prepared. Then the polishing liquid fed to a polishing device 1 is changed over to the polishing liquid of small polishing particle from a polishing liquid of large polishing particle under the operation of the polishing device 1. The necessary time for polishing the work A in the specified surface roughness can thus be shortened.


Inventors:
KITAMURA SHINOBU
Application Number:
JP24492590A
Publication Date:
April 30, 1992
Filing Date:
September 14, 1990
Export Citation:
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Assignee:
SHOWA ALUMINUM CORP
International Classes:
B24B37/00; B24B37/08; (IPC1-7): B24B37/00; B24B37/04
Attorney, Agent or Firm:
Hisayoshi Shimizu



 
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