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Patent Searching and Data


Title:
POLISHING METHOD
Document Type and Number:
Japanese Patent JP2001232558
Kind Code:
A
Abstract:

To shorten a polishing time to perform polishing efficiently, provide high precision, and reduce cost in a polishing method for performing precise polishing using abrasive grains.

After polishing a substrate using free abrasive grains 10 mainly, polishing liquid 13 containing diamond abrasive grains having a larger particle diameter than that used in the substrate polishing is supplied to a polishing face 1a of the same surface plate as a polishing surface plate 1 used for substrate polishing, both of them are relatively slid while a correction ring 6 is brought into contact with the polishing face 1a, and a part of the free abrasive grains 10 is embedded into the polishing face 1a to form fixed abrasive grains 11 in order to polish a workpiece by the fixed abrasive grains 11.


Inventors:
MORIWAKI TSUTOMU
Application Number:
JP2000047283A
Publication Date:
August 28, 2001
Filing Date:
February 24, 2000
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
B24B7/00; B24B37/00; B24B55/06; (IPC1-7): B24B37/00; B24B7/00; B24B55/06
Attorney, Agent or Firm:
Hiroshi Maeda (1 person outside)