To provide a polishing pad and a polishing machine using the polishing pad, polishing a member to be polished having a polygonal surface to be polished without the risk of damaging the outer peripheral part, and maintaining the polishing efficiency equal to that of a polishing pad having a grid-like polishing groove.

This polishing pad 10 includes a grid-like groove 11 (11a, 11b) provided on the contact surface with the surface to be polished, and the respective line grooves constituting the grid-like groove are formed by a curve. The polishing machine includes: a polishing platen where a flat plate-like member (w) to be polished is placed; and a pressure platen disposed opposite to the polishing platen to press the member to be polished to the polishing platen side, and a polishing pad is stuck to at least the surface of the polishing platen.