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Title:
POLISHING PAD, METHOD FOR MANUFACTURING POLISHING PAD, AND METHOD FOR POLISHING SURFACE OF OPTICAL MATERIAL OR SEMICONDUCTOR MATERIAL
Document Type and Number:
Japanese Patent JP2022109235
Kind Code:
A
Abstract:
To provide a polishing pad capable of suppressing a defect in a polished object, a method for manufacturing the polishing pad, and a method for polishing a surface of an optical material or a semiconductor material using the polishing pad.SOLUTION: A polishing pad has a polishing layer containing a polyurethane resin, in which the polyurethane resin is a cured product of a curable resin composition containing an isocyanate-terminated urethane prepolymer and a curing agent, the isocyanate-terminated urethane prepolymer is a reaction product of a polyol component and a polyisocyanate component, and the polyol component contains polyether polycarbonate diol represented by the following formula (I). In the formula (I), R1 is a divalent hydrocarbon group having 2 to 10 carbon atoms, a plurality of R1 may be the same or different, n is an integer of 2-30, and m is an integer of 1-20.SELECTED DRAWING: None

Inventors:
KAWAMURA YOSHIHIDE
TATENO TEPPEI
KURIHARA HIROSHI
NARUSHIMA SATSUKI
TAKAMIZAWA YAMATO
OCHI KEISUKE
KAWASAKI TETSUAKI
Application Number:
JP2022001608A
Publication Date:
July 27, 2022
Filing Date:
January 07, 2022
Export Citation:
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Assignee:
FUJIBO HOLDINGS INC
International Classes:
B24B37/24; C08G18/10; C08G18/32; C08G18/44; C08G18/65; C08G18/76; H01L21/304
Attorney, Agent or Firm:
Osamu Yamamoto
Toru Miyamae
Junichi Matsuo
Koichi Yokota