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Title:
POLISHING PAD
Document Type and Number:
Japanese Patent JP2002036097
Kind Code:
A
Abstract:

To prevent permeation of slurry into a base layer of a polishing pad by providing a waterproofing layer on a peripheral side surface of the base layer, and thereby prevent adversary influences on polishing property and to improve detecting accuracy of a polishing rate.

This polishing pad 1 is provided with the base layer 11 and a pad body 10 laminated on a surface of the base layer 11. The waterproofing layer 12 is provided on a peripheral side surface of the base layer 11. A groove part 13 may be formed on a surface of a surface plate side of the base layer 11.


Inventors:
HATTORI MINEO
NISHIMURA MITSUTOSHI
KOMORIYA KAZUO
HANAMOTO TAKASHI
Application Number:
JP2000218112A
Publication Date:
February 05, 2002
Filing Date:
July 18, 2000
Export Citation:
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Assignee:
RODEL NITTA CO
International Classes:
B24B37/20; B24B37/22; B24B37/24; H01L21/304; (IPC1-7): B24B37/00; H01L21/304
Domestic Patent References:
JPH11156701A1999-06-15
JPS62153047A1987-07-08
JPH1170460A1999-03-16
JPH05177538A1993-07-20
JPH09155730A1997-06-17
JPH1158220A1999-03-02
Attorney, Agent or Firm:
Shusaku Yamamoto



 
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