Title:
POLISHING PAD
Document Type and Number:
Japanese Patent JP2002176017
Kind Code:
A
Abstract:
To provide a polishing pad used in a CMP method and capable of allowing high flatness and high uniformity in a surface of a wafer to be compatible and having no possibility of generating a release or the like at its using time.
The polishing pad comprises one foamed sheet without adhering structure by foaming by impregnating after co-extrusion molding or dichroic molding, or co-extrusion foam molding or dichroic foam molding.
Inventors:
KOIKE HISAO
IMAUCHI TOSHIO
NAKAMURA ATSUSHI
IMAUCHI TOSHIO
NAKAMURA ATSUSHI
Application Number:
JP2000371846A
Publication Date:
June 21, 2002
Filing Date:
December 06, 2000
Export Citation:
Assignee:
ASAHI KASEI CORP
International Classes:
B24B37/20; B24B37/24; B29C44/00; B29C47/06; C08J9/12; H01L21/304; (IPC1-7): H01L21/304; B24B37/00; B29C44/00; B29C47/06