Title:
POLISHING PAD
Document Type and Number:
Japanese Patent JP2006110686
Kind Code:
A
Abstract:
To provide a polishing pad, detecting the optical end point with high accuracy in the process of polishing, and preventing slurry from leaking between a polishing area and a light transmission area even in the case of long-time use, and to provide a manufacturing method of a semiconductor device using the polishing pad.
In the polishing pad having the polishing area and the light transmission area, the polishing area has an opening area for providing the light transmission area, a rugged part A is formed in the periphery of the opening part, a rugged part B is formed in the periphery of the light transmission area, and the rugged part A and the rugged part B are engaged with each other.
Inventors:
NAKAMORI MASAHIKO
SHIMOMURA TETSUO
YAMADA TAKATOSHI
OGAWA KAZUYUKI
KAZUNO ATSUSHI
WATANABE KIMIHIRO
SHIMOMURA TETSUO
YAMADA TAKATOSHI
OGAWA KAZUYUKI
KAZUNO ATSUSHI
WATANABE KIMIHIRO
Application Number:
JP2004301734A
Publication Date:
April 27, 2006
Filing Date:
October 15, 2004
Export Citation:
Assignee:
TOYO TIRE & RUBBER CO
International Classes:
B24B37/20; H01L21/304
Domestic Patent References:
| JPS62180416U | 1987-11-16 | |||
| JP2004134539A | 2004-04-30 | |||
| JPH1083977A | 1998-03-31 | |||
| JP2002372657A | 2002-12-26 | |||
| JP2002013955A | 2002-01-18 | |||
| JPS6472377A | 1989-03-17 | |||
| JP2003068686A | 2003-03-07 | |||
| JP2004106174A | 2004-04-08 |
Attorney, Agent or Firm:
Takao Suzuki
Koichi Kajisaki
Yuzo Ozaki
Toshihiko Taniguchi
Koichi Kajisaki
Yuzo Ozaki
Toshihiko Taniguchi
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