Title:
POLISHING PAD
Document Type and Number:
Japanese Patent JP2007307639
Kind Code:
A
Abstract:
To provide a polishing pad having a superior optical detection accuracy in a wide wavelength range (especially in a short wavelength side); and a manufacturing method of semiconductor device including a process of polishing the surface of a semiconductor wafer surface using the polishing pad.
This polishing pad having a polishing layer including a polishing area 9 and a light transmission area 8 is characterized in that the light transmission area is composed of polyurethane resin with aromatic ring concentration of 2 wt.% or less, and a light transmittance of the light transmission area is 30% or more in the whole area of the wavelength of 300-400 nm.
COPYRIGHT: (C)2008,JPO&INPIT
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Inventors:
FUKUDA TAKESHI
HIROSE JUNJI
NAKAI YOSHIYUKI
KIMURA TAKESHI
HIROSE JUNJI
NAKAI YOSHIYUKI
KIMURA TAKESHI
Application Number:
JP2006137356A
Publication Date:
November 29, 2007
Filing Date:
May 17, 2006
Export Citation:
Assignee:
TOYO TIRE & RUBBER CO
International Classes:
B24B37/013; B24B37/20; H01L21/304
Domestic Patent References:
| JP2005322790A | 2005-11-17 | |||
| JP2006045523A | 2006-02-16 | |||
| JP2004297061A | 2004-10-21 | |||
| JP2006102940A | 2006-04-20 | |||
| JP2006110686A | 2006-04-27 | |||
| JP2003012596A | 2003-01-15 | |||
| JP2005175464A | 2005-06-30 |
Attorney, Agent or Firm:
Koichi Kajisaki
Yuzo Ozaki
Toshihiko Taniguchi
Yuzo Ozaki
Toshihiko Taniguchi