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Patent Searching and Data


Title:
POLISHING PAD
Document Type and Number:
Japanese Patent JPH08197412
Kind Code:
A
Abstract:

PURPOSE: To quickly strip off a pad with small power without scratching a surface plate by sticking a sticking film on the back face of the pad to be stuck to the surface plate of a polishing machine and providing perforation in the sticking film to be cut off when stripped from the surface plate.

CONSTITUTION: A polishing pad 1 comprises a pad body 2 stuck to the surface plate 4 of a polishing device through a sticking film 3 and is provided with a spiral cut-off line 5 such as perforation in the sticking film 3 to cut-off the pad body 3. At a position corresponding to the outer end section of the spiral cut-off line 5 in the outer periphery of the pad body 2, a mark 6 is provided to indicate the starting position of cutting. In order to strip a pad body 2 worn or damaged from the surface plate 4, stripping of the pad body 2 is started from the position of the mark 6 and is made little by little while cutting-off along the cutting line 5 in order. This constitution serves to strip the pad body 2 from the surface plate 4 without scratching the surface plate 4.


Inventors:
KURITA TAMOTSU
Application Number:
JP2593495A
Publication Date:
August 06, 1996
Filing Date:
January 20, 1995
Export Citation:
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Assignee:
SPEEDFAM CO LTD
International Classes:
B24B37/20; B24B37/24; (IPC1-7): B24B37/00
Attorney, Agent or Firm:
Hiroshi Hayashi (1 person outside)