Title:
POLISHING SOLUTION FOR COPPER AND POLISHING METHOD
Document Type and Number:
Japanese Patent JP2006086353
Kind Code:
A
Abstract:
To provide a polishing solution for copper which has a quick CMP rate, scarcely generates a polishing remainder, enables LSIs to be manufactured, and in particular, targets copper metal and copper alloy to be polished; and to provide a chemical mechanical polishing method using the polishing solution for copper.
This polishing liquid is a polishing solution for use in a chemical mechanical polishing in manufacturing a semiconductor device or the like, and contains a specific anthranilic acid compound and an oxidant. Also, the chemical mechanical polishing method is provided using the polishing solution for copper.
Inventors:
SEKI HIROYUKI
ASANUMA NAOKI
ASANUMA NAOKI
Application Number:
JP2004269940A
Publication Date:
March 30, 2006
Filing Date:
September 16, 2004
Export Citation:
Assignee:
FUJI PHOTO FILM CO LTD
International Classes:
H01L21/304; B24B37/00; C09K3/14
Attorney, Agent or Firm:
Shohei Oguri
Hironori Honda
Toshimitsu Ichikawa
Takeshi Takamatsu
Yuriko Hamada
Hironori Honda
Toshimitsu Ichikawa
Takeshi Takamatsu
Yuriko Hamada
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