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Title:
POLYACETAL RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH02132117
Kind Code:
A
Abstract:
PURPOSE:To obtain the title composition capable of giving molded products of both high impact strength and flexural resistance causing no surface debonding and little mold adherence by melt kneading treatment, in the presence of e.g., polyisocyanate, of a polyacetal resin and thermoplastic polyurethane at specified ratio. CONSTITUTION:The objective composition can be obtained by melt kneading treatment of (A) 99-40 (pref. 97-50) wt.% of a polyacetal resin [pref. oxymethylene (co)polymer with oxymethylene group as the main constituent] and (B) 1-60 (pref. 3-50) wt.% of a thermoplastic polyurethane (pref. prepared from diisocyanate compound, high-molecular weight polyol 500-5000 in molecular weight and low-molecular weight polyol 60-500 in molecular weight and/or polyamine), in the presence of (C) 0.1-10wt.% based on the components A+B, of polyisocyanate or polyisothiocyanate compound or modified product therefrom.

Inventors:
SUGIYAMA KUNIYUKI
MOCHIZUKI MITSUHIRO
Application Number:
JP6023289A
Publication Date:
May 21, 1990
Filing Date:
March 13, 1989
Export Citation:
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Assignee:
POLYPLASTICS CO
International Classes:
C08G18/10; C08G18/40; C08L59/02; C08G18/56; C08K5/29; C08L59/00; C08L75/04; (IPC1-7): C08G18/56; C08L59/02
Domestic Patent References:
JP40017900A
JPS59145243A1984-08-20
JPS6119652A1986-01-28
JP60500577Y
JPS61148221A1986-07-05
Attorney, Agent or Firm:
Kaoru Furuya



 
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