Title:
POLYAMIDE COMPOSITION
Document Type and Number:
Japanese Patent JP2011057975
Kind Code:
A
Abstract:
To provide a polyamide composition excellent in heat resistance, flowability, and mold releasability at molding, and further excellent in a low water-absorption property.
The polyamide composition contains: (A) a polyamide obtained by polymerizing (a) a dicarboxylic acid containing at least 50 mol% of an aliphatic dicarboxylic acid with (b) a diamine containing at least 50 mol% of a diamine having a substituent branched from the main chain; and (B) a crystalline thermoplastic resin other than the polyamide.
Inventors:
TERADA KAZUNORI
SAKATA NORIO
HINOTO YU
SAKATA NORIO
HINOTO YU
Application Number:
JP2010178808A
Publication Date:
March 24, 2011
Filing Date:
August 09, 2010
Export Citation:
Assignee:
ASAHI KASEI CHEMICALS CORP
International Classes:
C08L77/06; C08K3/26; C08K3/34; C08K7/04
Domestic Patent References:
| JPH0912868A | 1997-01-14 |
Foreign References:
| WO2008149862A1 | 2008-12-11 | |||
| WO2002048239A1 | 2002-06-20 |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Kazuhiko Naito
Toshifumi Onuki
Kazuhiko Naito