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Title:
POLYAMIDE IMIDE AND PRODUCTION METHOD THEREOF, POLYAMIDE IMIDE-BASED INSULATING COATING, AND INSULATED WIRE
Document Type and Number:
Japanese Patent JP2009149757
Kind Code:
A
Abstract:

To provide a polyamide imide capable of enhancing a resin solid content in a coating without lowering insulation of an insulating coating film and a production method thereof, a polyamide imide-based insulating coating containing the polyamide imide, and an insulated wire coated with the polyamide imide-based insulating coating.

This production method of the polyamide imide includes reacting an acid component containing trimellitic acid with an isocyanate component containing an aromatic diisocyanate, characterized in that the acid component and the isocyanate component are reacted with each other in the presence of a caprolactam compound. The polyamide imide-based insulating coating contains 40% by mass or more of the polyamide imide obtained by the above production method and having a weight average molecular weight of 800 to 20,000. The insulated wire is produced by coating a conductor with the above polyamide imide-based insulating coating and by burning the coating into the conductor.


Inventors:
YOSHIDA KENGO
MATSUI KATSUFUMI
KOYANO MASAHIRO
Application Number:
JP2007328484A
Publication Date:
July 09, 2009
Filing Date:
December 20, 2007
Export Citation:
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Assignee:
SUMITOMO ELECTRIC WINTEC INC
International Classes:
C08G73/14; C09D5/25; C09D7/12; C09D179/08; H01B3/30; H01B7/02
Domestic Patent References:
JPS5880326A1983-05-14
JPS59126422A1984-07-21
JPH02117957A1990-05-02
Attorney, Agent or Firm:
Patent Business Corporation Suncrest International Patent Office