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Title:
POLYAMIDE RESIN COMPOSITION FOR INJECTION WELDING MOLDING
Document Type and Number:
Japanese Patent JPH11166118
Kind Code:
A
Abstract:

To obtain a composition which can give a molding excellent in mechanical strength, heat resistance, chemical resistance, and weld strength by specifying the shear stress vs. shear rate relationship at a specified resin temperature.

There is provided a resin composition desirably comprising 40-90 wt.% polyamide resin and 10-60 wt.% glass fiber, wherein m is 0.33 or above, desirably, 0.35 or above at a resin temperature of 280°C. The above m is calculated according to the equation:m=(logτ1-logτ2)/(logγ1-logγ2)[wherein γ1 and γ2 are shear rates (1/sec) and are in the renege: 3,000<γ2<γ1<7,000;τ1 is the shear stress at the shear rate γ1; and τ2 is the shear stress at the shear rate γ2]. It is desirable that polyamide resin used is a mixture comprising 50-95 wt.% nylon 6, nylon 66 or copolymer nylon 6/66 and/or polyamide having a relative viscosity (25°C) of 2.0-3.0 as measured in 98% sulfuric acid in a concentration of 1 wt.% and 5-50 wt.% polyamide having a relative viscosity (at 25°C) of 4.0-7.0 as measured under the same conditions.


Inventors:
URABE HIROSHI
TSUNODA MORIO
HAYAZAKI HIDEHIRO
OYAMA HAJIME
Application Number:
JP33150897A
Publication Date:
June 22, 1999
Filing Date:
December 02, 1997
Export Citation:
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Assignee:
MITSUBISHI ENG PLAST CORP
International Classes:
B29C45/14; C08K7/14; C08L77/00; B29K77/00; (IPC1-7): C08L77/00; B29C45/14; C08K7/14
Attorney, Agent or Firm:
Hasegawa Moji