To provide a polyamide-based resin composition for coating, having excellent adhesiveness to metallic substrates and usable without using a primer for bonding.

The polyamide resin composition is produced by compounding a polyamide resin with a silane coupling agent and an epoxidized styrenic thermoplastic elastomer obtained by epoxidizing a double bond derived from a conjugated diene compound of a block copolymer composed of a polymer block composed mainly of a styrenic compound and a polymer block composed mainly of a conjugated diene compound or its partial hydrogenation product. The content of the silane coupling agent is 0.01-0.3 wt.% and that of the epoxidized styrenic thermoplastic elastomer is 3-30 wt.% based on the total composition.

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